Application Deadlines

To be considered for funding in the spring bond issue, all complete leveraged loan applications (over $3.0 million) must be submitted by January 15th. If there is sufficient demand and loan capacity, a second bond issue may take place in the fall. The application deadline date for any fall bond issue is June 15th.

 

All application deadlines are firm due to the review period required prior to presentation to the

Authority Board for loan approval.

 

Applicants should coordinate with their Project Manager from the WQCD to determine the appropriate application submittal schedule to ensure Board action in a timely manner. Incomplete applications may delay Board consideration.